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AGC's leading edge AL-X Series, photo curable Low-K dielectric polymer for electronic and wafer level packaging (WLP) meets the most demanding industry requirements. AL-X is a highly cross-linked thermosetting fluorinated polymer exhibiting a unique combination of properties ideally suited for today's packaging needs. AL-X has been specifically designed for wafer level redistribution layers and Integrated Passive Device (IPD) packaging applications.

AGC AL-X Series is very easy to process and can be used with conventional spin-on and UV curing equipment. It has superior adhesion to all layers and provides excellent shape and tolerances to the most severe geometries. Low cure temperature from 180°C to 250°C and high elongation makes AL-X an easy insert into your current manufacturing process.

 

Product Features

Product Features

  • Low dielectric constant
  • Low dielectric loss
  • Superior thermal stability
  • Excellent adhesion to various packaging layers
  • Superior moisture resistance
  • Outstanding gap-fill characteristics
  • Low cure temperatuire
  • Very low film stress

Thermal Stability

WLP and ILP

Comparison of Typical Packaging Materials

  AL-X2 BCB Polyimide Epoxy
Cure Temperature 180 ~ 250 225-250 350 190 ~ 200
Elongation at Break (%)
Young's Modulus (GPa)
Tensile Strength (MPa)
20
1.3
90
8
2.9
87
10 ~ 40
2 ~ 4
100 ~ 150
6
4
100
Photodefinition Negative
/Solvent
Negative
/Solvent
Various Negative
/Aqueous
Dielectric Constant
Water Absorption (%)
Adhesion
2.7
<0.3
Excellent
2.7
0.24
 
3.2 ~ 3.5
~3
 
>2.9
>0.3
 

 
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