Photomask Substrates
AGC offers the most advanced materials for photomask substrates available today. Outstanding features include low thermal expansion, high purity, high optical transmission at deep ultraviolet wavelengths, and high chemical durability.
Grades:
AQ | Photomask substrates for i-line and KrF excimer lasers lithography |
QC-i | Photomask substrates for ArF excimer laser lithography
|
Flatness
<100nm for each side.
Polishing Defect Status
Low defect counts.
Typical Properties
AQ | |||
Chemical Constitution | SiO2 | wt (%) | 100 |
Thermal Properties | CTE Softening Point Annealing Point Strain Point |
ppm/K (50-200°C) °C °C °C |
0.6 1,600 1,120 1,060 |
Optical Properties | Refracive Index | nD | 1.46 |
Chemical Properties | Acid Resistance Alkali Resistance |
mg/cm2 mg/cm2 |
0.000 0.032 |
Mechanical Properties | Density Young’s Modulus Knoop Micro Hardness |
g/cm3 GPa kg/mm2 |
2.20 74 540 |
Electrical Properties | Bulk Resistive Dielectric Constant |
log (Ω•cm) at 200°C at 1MH,R.T. |
12.5 4.0 |
Typical data, not guaranteed
Contact us to Request Product Literature and More Information
Please email ea.customerservice@agc.com